Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430730 | Wiring substrate and semiconductor device | Yuki Aritsuka, Masaya Tanaka, Yumi Yoshii, Miyuki Suzuki, Shuji Sagara | 2022-08-30 |
| 11373906 | Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate | Shinji Maekawa, Hiroshi Kudo, Hiroshi Mawatari, Masaaki Asano | 2022-06-28 |
| 11217530 | Line structure and a method for producing the same | Hiroshi Kudo | 2022-01-04 |