Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373906 | Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate | Shinji Maekawa, Takamasa Takano, Hiroshi Mawatari, Masaaki Asano | 2022-06-28 |
| 11217530 | Line structure and a method for producing the same | Takamasa Takano | 2022-01-04 |