Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373906 | Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate | Shinji Maekawa, Hiroshi Kudo, Takamasa Takano, Hiroshi Mawatari | 2022-06-28 |