Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444955 | Verification of in-situ network telemetry data in a packet-switched network | Shwetha Subray Bhandari, Santhosh N, Saiprasad Muchala, Frank Brockners | 2022-09-13 |
| 11257560 | Test architecture for die to die interconnect for three dimensional integrated circuits | Sreejit Chakravarty, Fei Su, Puneet Gupta, Wei Ming Lim, Terrence Huat Hin Tan +4 more | 2022-02-22 |