Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538734 | Power semiconductor package with highly reliable chip topside | Fabian Mohn, Alexey Sokolov | 2022-12-27 |
| 11509191 | Electric assembly and vehicle having the same | Hongbin Luo, Yi Ren, Guangquan Chen, Daqi Chen, Shuanghong Jing | 2022-11-22 |
| 11348896 | Method for producing a semiconductor module by using adhesive attachment prior to sintering | Fabian Mohn, Jürgen Schuderer | 2022-05-31 |