Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348896 | Method for producing a semiconductor module by using adhesive attachment prior to sintering | Chunlei Liu, Fabian Mohn | 2022-05-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348896 | Method for producing a semiconductor module by using adhesive attachment prior to sintering | Chunlei Liu, Fabian Mohn | 2022-05-31 |