Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538734 | Power semiconductor package with highly reliable chip topside | Alexey Sokolov, Chunlei Liu | 2022-12-27 |
| 11348896 | Method for producing a semiconductor module by using adhesive attachment prior to sintering | Chunlei Liu, Jürgen Schuderer | 2022-05-31 |
| 11343943 | Heat dissipation for power switches | Giovanni Salvatore, Slavo Kicin | 2022-05-24 |