Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538734 | Power semiconductor package with highly reliable chip topside | Fabian Mohn, Chunlei Liu | 2022-12-27 |
| 11515110 | Nozzle for high or medium voltage circuit breaker | Jakub Korbel, Olaf Hunger, Reto Karrer, Henrik Dahlgren, Giang PhamVan | 2022-11-29 |