Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11499229 | Substrate supports including metal-ceramic interfaces | Chidambara A. Ramalingam, Joseph M. Polese, Katty Marie Lydia Gamon Guyomard, Jian Li | 2022-11-15 |
| 11434569 | Ground path systems for providing a shorter and symmetrical ground path | Tuan Nguyen, Jason M. Schaller, Edward P. Hammond, IV, David Blahnik, Tejas Ulavi +3 more | 2022-09-06 |
| 11276569 | On stack overlay improvement for 3D NAND | Yongjing Lin, Tza-Jing Gung, Masaki Ogata, Yusheng Zhou, Xinhai Han +3 more | 2022-03-15 |