Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462467 | Lead frame, package structure comprising the same and method for manufacturing the package structure | Chia-Hsiu Huang, Chun-Chen Chen, Wei Chih Cho, Shao-Lun Yang | 2022-10-04 |
| 11450596 | Lead frame, package structure and method for manufacturing the same | Yi-Cheng Hsu, Chih-Hung Hsu, Mei-Lin Hsieh, Yuan-Chun Chen, Ko-Pu WU +1 more | 2022-09-20 |