Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450596 | Lead frame, package structure and method for manufacturing the same | Yi-Cheng Hsu, Chih-Hung Hsu, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu WU +1 more | 2022-09-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450596 | Lead frame, package structure and method for manufacturing the same | Yi-Cheng Hsu, Chih-Hung Hsu, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu WU +1 more | 2022-09-20 |