Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462467 | Lead frame, package structure comprising the same and method for manufacturing the package structure | Chun-Chen Chen, Wei Chih Cho, Shao-Lun Yang, Yu-Shun Hsieh | 2022-10-04 |
| 11367638 | Load port | Yu-Min Chu, Cho-Chun Chung | 2022-06-21 |