Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462467 | Lead frame, package structure comprising the same and method for manufacturing the package structure | Chia-Hsiu Huang, Chun-Chen Chen, Wei Chih Cho, Yu-Shun Hsieh | 2022-10-04 |
| 11443997 | Semiconductor package and method of manufacturing the same | Wei Chih Cho, Chun-Chen Chen | 2022-09-13 |
| 11444032 | Semiconductor package device and method for manufacturing the same | Yencheng Kuo | 2022-09-13 |