Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410899 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Jen-Chieh Kao | 2022-08-09 |
| 11296034 | Substrate and semiconductor package comprising an interposer element with a slot and method of manufacturing the same | Wei-Hao Chang | 2022-04-05 |