Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462455 | Semiconductor package device and method of manufacturing the same | Shiu-Fang Yen, Chang-Lin Yeh | 2022-10-04 |
| 11410899 | Semiconductor package device and method of manufacturing the same | Yi-Chi Chen, Chang-Lin Yeh | 2022-08-09 |