Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462455 | Semiconductor package device and method of manufacturing the same | Shiu-Fang Yen, Jen-Chieh Kao | 2022-10-04 |
| 11437415 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Yung-I Yeh, Sheng-Yu Chen | 2022-09-06 |
| 11410899 | Semiconductor package device and method of manufacturing the same | Yi-Chi Chen, Jen-Chieh Kao | 2022-08-09 |
| 11289394 | Semiconductor package structure | Sheng-Yu Chen, Ming-Hung Chen | 2022-03-29 |
| 11222792 | Semiconductor package device and method of manufacturing the same | — | 2022-01-11 |
| 11224132 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Yung-I Yeh, Sheng-Yu Chen | 2022-01-11 |