Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296034 | Substrate and semiconductor package comprising an interposer element with a slot and method of manufacturing the same | Yi-Chi Chen | 2022-04-05 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296034 | Substrate and semiconductor package comprising an interposer element with a slot and method of manufacturing the same | Yi-Chi Chen | 2022-04-05 |