Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538772 | Semiconductor device package and method of manufacturing the same | Cheng-Yu Ho | 2022-12-27 |
| 11508655 | Semiconductor package structure and method for manufacturing the same | Yung-Shun Chang, Teck-Chong Lee | 2022-11-22 |
| 11508668 | Semiconductor package structure and method for manufacturing the same | Cheng-Yuan KUNG, Hung-Yi Lin, Yu-Pin Tsai | 2022-11-22 |
| 11342282 | Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the same | Hsu-Chiang Shih, Hung-Yi Lin, Yu-Sheng Chang, Hsiu-Chi Liu, Mark A. Gerber | 2022-05-24 |
| 11329015 | Semiconductor device package and method of manufacturing the same | — | 2022-05-10 |
| 11329016 | Semiconductor device package and method of manufacturing the same | Chieh-Chen Fu | 2022-05-10 |