Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515241 | Semiconductor device package and method of manufacturing the same | Teck-Chong Lee | 2022-11-29 |
| 11508655 | Semiconductor package structure and method for manufacturing the same | Meng-Wei Hsieh, Teck-Chong Lee | 2022-11-22 |
| 11495572 | Semiconductor package device and method of manufacturing the same | Teck-Chong Lee | 2022-11-08 |
| 11373967 | Semiconductor device package and method for packaging the same | Teck-Chong Lee, Sheng-Wen Yang | 2022-06-28 |
| 11276620 | Package structure and method for manufacturing the same | Teck-Chong Lee | 2022-03-15 |