Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373967 | Semiconductor device package and method for packaging the same | Yung-Shun Chang, Teck-Chong Lee | 2022-06-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373967 | Semiconductor device package and method for packaging the same | Yung-Shun Chang, Teck-Chong Lee | 2022-06-28 |