Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342282 | Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the same | Hsu-Chiang Shih, Hung-Yi Lin, Meng-Wei Hsieh, Hsiu-Chi Liu, Mark A. Gerber | 2022-05-24 |