Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508668 | Semiconductor package structure and method for manufacturing the same | Hung-Yi Lin, Meng-Wei Hsieh, Yu-Pin Tsai | 2022-11-22 |
| 11502067 | Package structure and method for manufacturing the same | Chien-Hua Chen | 2022-11-15 |
| 11348885 | Semiconductor package structure and method for manufacturing the same | Hung-Yi Lin | 2022-05-31 |
| 11296043 | Semiconductor device packages and methods of manufacturing the same | Hung-Yi Lin, Chang-Yu Lin | 2022-04-05 |
| 11233010 | Assembly structure and package structure | Hung-Yi Lin | 2022-01-25 |