Issued Patents 2022
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502067 | Package structure and method for manufacturing the same | Cheng-Yuan KUNG | 2022-11-15 |
| 11478793 | Microfluidic devices | Viktor Shkolnikov, Michael W. Cumbie | 2022-10-25 |
| 11440694 | Device and method of test tube preparation | Feng-Yi Tai | 2022-09-13 |
| 11440009 | Plurality of filters | Michael W. Cumbie, Devin Alexander Mourey | 2022-09-13 |
| 11433571 | Movable mold insert adjuster | Jimmy Perez | 2022-09-06 |
| 11433670 | Conductive elements electrically coupled to fluidic dies | Michael W. Cumbie, Randy Hoffman | 2022-09-06 |
| 11426900 | Molding a fluid flow structure | Michael W. Cumbie, Arun Agarwal | 2022-08-30 |
| 11408684 | Loop heat pipe evaporator | Bradley Richard, William G. Anderson, Richard W. Bonner, III, Devin Pellicone, Greg Hoeschele +3 more | 2022-08-09 |
| 11390076 | Fluid feed path wettability coating | Michael G. Groh, Zhizhang Chen | 2022-07-19 |
| 11390081 | Fluid ejection device with a carrier having a slot | Christopher A. Leonard, Anthony M. Fuller | 2022-07-19 |
| 11390075 | Fluidic dies | Si-lam Choy, Michael W. Cumbie | 2022-07-19 |
| 11364493 | Planarization layers over silicon dies | Michael W. Cumbie | 2022-06-21 |
| 11364497 | Embedded microfluidic devices | Michael W. Cumbie | 2022-06-21 |
| 11364496 | Coplanar fluidic interconnect | Michael W. Cumbie, Viktor Shkolnikov | 2022-06-21 |
| 11358390 | Carriers including fluid ejection dies | Michael W. Cumbie | 2022-06-14 |
| 11351787 | Curved fluid ejection devices | Michael W. Cumbie, Si-Iam J. Choy | 2022-06-07 |
| 11331915 | Fluid ejection dies | Michael W. Cumbie | 2022-05-17 |
| 11325378 | Print head interposers | Michael W. Cumbie, Devin Alexander Mourey | 2022-05-10 |
| 11325125 | Particle separation | Viktor Shkolnikov | 2022-05-10 |
| 11318750 | Fluid property sensor | Michael W. Cumbie, Anthony D. Studer | 2022-05-03 |
| 11318469 | Selective release of material in thermally degradable capsule | Viktor Shkolnikov | 2022-05-03 |
| 11292257 | Molded die slivers with exposed front and back surfaces | Michael W. Cumbie | 2022-04-05 |
| 11292265 | Fluid circulation and ejection | Si-lam Choy, Michael W. Cumbie | 2022-04-05 |
| 11278892 | Chip to chip fluidic interconnect | Michael W. Cumbie, Viktor Shkolnikov | 2022-03-22 |
| 11278887 | Microfluidic chip | Viktor Shkolnikov, Michael W. Cumbie | 2022-03-22 |