Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063157 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su +4 more | 2021-07-13 |
| 10985240 | Semiconductor device having diode devices with different barrier heights and manufacturing method thereof | Wen-Shun Lo, Felix Ying-Kit Tsui | 2021-04-20 |
| 10971404 | Semiconductor device | Hsin-Li Cheng, Felix Ying-Kit Tsui | 2021-04-06 |
| 10971596 | Semiconductor device with reduced flicker noise | Hsin-Li Cheng, Liang-Tai Kuo | 2021-04-06 |
| 10964586 | Semiconductor structure including isolations | Wen-Shun Lo, Felix Ying-Kit Tsui | 2021-03-30 |
| 10931191 | Half bridge circuit driver chip with protection circuit and protection method thereof | — | 2021-02-23 |