Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164822 | Structure of semiconductor device and method for bonding two substrates | Chung-Hsing Kuo, Chun-Ting Yeh, Ming-Tse Lin, Hui-Ling Chen | 2021-11-02 |
| 11145867 | Surface treated copper foil | Yao-Sheng Lai, Jui-Chang Chou | 2021-10-12 |
| 11088285 | Oxide semiconductor field effect transistor and forming method thereof | Yen-Chen Chen, Jen-Po Huang, Sheng-Yao Huang, Hui-Ling Chen, Qinggang Xing +3 more | 2021-08-10 |
| 10923730 | Electrodeposited copper foil with anti-burr property | Yao-Sheng Lai, Kuei-Sen Cheng, Jui-Chang Chou | 2021-02-16 |