Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164822 | Structure of semiconductor device and method for bonding two substrates | Chung-Hsing Kuo, Chun-Ting Yeh, Hui-Ling Chen, Chien-Ming Lai | 2021-11-02 |
| 10886241 | Semiconductor package structure | Chun-Hung Chen, Chu-Fu Lin | 2021-01-05 |