Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164822 | Structure of semiconductor device and method for bonding two substrates | Chun-Ting Yeh, Ming-Tse Lin, Hui-Ling Chen, Chien-Ming Lai | 2021-11-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164822 | Structure of semiconductor device and method for bonding two substrates | Chun-Ting Yeh, Ming-Tse Lin, Hui-Ling Chen, Chien-Ming Lai | 2021-11-02 |