Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structure of semiconductor device and method for bonding two substrates

Structure of semiconductor device and method for bonding two substrates

US Patent 11164822 · Granted Nov 2, 2021

Estimated economic value: $3,707,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optical sensor mechanism capable of mitigating signal nonlinearity2025
Semiconductor structure2025
Semiconductor structure for wafer level bonding and bonded semiconductor structu2025
Semiconductor structure2025
Semiconductor structure2025
Structure of semiconductor device2024
Structure of semiconductor device2024
Structure of semiconductor device2024
Structure of semiconductor device2024
Semiconductor structure2024
Surface-treated copper foil and copper clad laminate2024
Oxide semiconductor field effect transistor2024