Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11135848 | Liquid ejecting head and liquid ejecting apparatus | Mengfei Wong, Ryutaro Kusunoki | 2021-10-05 |
| 11069602 | Package and terminal arrangement for semiconductor module | Shogo Shibata, Maki Hasegawa, Koichiro Noguchi, Shigeru Mori, Toru Iwagami | 2021-07-20 |
| 10958011 | Wire container, connector assembly, and water-resistant connector | Tatsuya Hayashi | 2021-03-23 |