Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069602 | Package and terminal arrangement for semiconductor module | Shuhei Yokoyama, Shogo Shibata, Maki Hasegawa, Koichiro Noguchi, Shigeru Mori | 2021-07-20 |
TI
Toru Iwagami
Overall (2021): #229,217 of 548,734Top 45%
1
Patents 2021