Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069602 | Package and terminal arrangement for semiconductor module | Shuhei Yokoyama, Shogo Shibata, Maki Hasegawa, Shigeru Mori, Toru Iwagami | 2021-07-20 |
| 10998902 | Semiconductor module and semiconductor package | Kazuhiro KAWAHARA | 2021-05-04 |