Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069602 | Package and terminal arrangement for semiconductor module | Shuhei Yokoyama, Maki Hasegawa, Koichiro Noguchi, Shigeru Mori, Toru Iwagami | 2021-07-20 |
SS
Shogo Shibata
Overall (2021): #260,340 of 548,734Top 50%
1
Patents 2021