Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11032899 | Plasma processing apparatus and plasma processing method | Tetsuji Sato, Shojiro Yahata, Taira Takase | 2021-06-08 |
| 11004822 | Wire clamp apparatus calibration method and wire bonding apparatus | Naoya Taira | 2021-05-11 |
| 10886108 | Power feed structure and plasma processing apparatus | Yasuharu Sasaki | 2021-01-05 |