Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964594 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jing-Cheng Lin, Jui-Pin Hung, Tsan-Hua Tung | 2021-03-30 |
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Yi-Hang Lin
Overall (2021): #202,260 of 548,734Top 40%
1
Patents 2021