Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964594 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin | 2021-03-30 |
TT
Tsan-Hua Tung
Overall (2021): #224,696 of 548,734Top 45%
1
Patents 2021