Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107630 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng +6 more | 2021-08-31 |