Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081475 | Integrated circuit structure and method for reducing polymer layer delamination | Jing-Cheng Lin, Jui-Pin Hung, Hsien-Wen Liu | 2021-08-03 |
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Min-Chen Lin
Overall (2021): #331,243 of 548,734Top 65%
1
Patents 2021