Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139200 | Multi-layer structure having a dense middle layer | Chin Kun Lan | 2021-10-05 |
| 11043251 | Magnetic tunnel junction device and method of forming same | Bo-Jhih Shen, Kuang-I Liu, Jinn-Kwei Liang, Yi-Wei Chiu, Chin-Hsing Lin +4 more | 2021-06-22 |
| 11043373 | Interconnect system with improved low-k dielectrics | Yu Lun Ke, Yi-Wei Chiu | 2021-06-22 |