CL

Chin Kun Lan

TSMC: 1 patents #1,794 of 3,494Top 55%
Overall (2021): #499,370 of 548,734Top 95%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11139200 Multi-layer structure having a dense middle layer Joung-Wei Liou 2021-10-05