Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211354 | Systems and methods for semi-flexible eutectic bonder piece arranegments | Chih-Hang Chang, Richard Huang, I-Shi Wang, Yin-Tun Chou | 2021-12-28 |
| 11192775 | Rough layer for better anti-stiction deposition | Chih-Hang Chang, I-Shi Wang | 2021-12-07 |
| 11192778 | MEMS package with roughend interface | Yu-Jui Chen, I-Shi Wang, Ren-Dou Lee | 2021-12-07 |
| 11174156 | Bonding process for forming semiconductor device structure | Chih-Hang Chang, I-Shi Wang | 2021-11-16 |
| 11034578 | Multi-layer sealing film for high seal yield | Chih-Chien Yang, Ming-Lun Shih, Ren-Dou Lee | 2021-06-15 |