Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211354 | Systems and methods for semi-flexible eutectic bonder piece arranegments | Chih-Hang Chang, Richard Huang, Yin-Tun Chou, Jen-Hao Liu | 2021-12-28 |
| 11192775 | Rough layer for better anti-stiction deposition | Chih-Hang Chang, Jen-Hao Liu | 2021-12-07 |
| 11192778 | MEMS package with roughend interface | Yu-Jui Chen, Ren-Dou Lee, Jen-Hao Liu | 2021-12-07 |
| 11174156 | Bonding process for forming semiconductor device structure | Chih-Hang Chang, Jen-Hao Liu | 2021-11-16 |
| 11101491 | Semiconductor structures having a micro-battery and methods for making the same | Chyi-Tsong Ni, Yi-Hsun Chiu, Ching-Hou Su | 2021-08-24 |