Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11192778 | MEMS package with roughend interface | Yu-Jui Chen, I-Shi Wang, Jen-Hao Liu | 2021-12-07 |
| 11034578 | Multi-layer sealing film for high seal yield | Chih-Chien Yang, Ming-Lun Shih, Jen-Hao Liu | 2021-06-15 |