Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211354 | Systems and methods for semi-flexible eutectic bonder piece arranegments | Richard Huang, I-Shi Wang, Yin-Tun Chou, Jen-Hao Liu | 2021-12-28 |
| 11192775 | Rough layer for better anti-stiction deposition | I-Shi Wang, Jen-Hao Liu | 2021-12-07 |
| 11174156 | Bonding process for forming semiconductor device structure | I-Shi Wang, Jen-Hao Liu | 2021-11-16 |