Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177228 | Semiconductor device and bump formation process | Sheng-Yu Wu, Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chien-Hung Kuo +3 more | 2021-11-16 |
CC
Chun-Mao Chiu
Overall (2021): #503,647 of 548,734Top 95%
1
Patents 2021