Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2021-08-24 |