Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11173637 | Forming mold with linkage type lateral auxiliary pressurization | Chun-Chih Kuo, Tse-Chang Li, Dai-You Wu | 2021-11-16 |
| 11152486 | FinFET semiconductor device having source/drain contact(s) separated by airgap spacer(s) from the gate stack(s) to reduce parasitic capacitance | Kai-Hsuan Lee, Wei-Yang Lee, Fu-Kai Yang, Yen-Ming Chen | 2021-10-19 |
| 11133229 | Forming transistor by selectively growing gate spacer | Kai-Hsuan Lee, Chia-Ta Yu, Sheng-Chen Wang, Bo-Yu Lai, Bo-Cyuan Lu +4 more | 2021-09-28 |
| 11062957 | FinFET device with wrapped-around epitaxial structure and manufacturing method thereof | Chia-Ta Yu, Kai-Hsuan Lee, Sai-Hooi Yeong, Feng-Cheng Yang | 2021-07-13 |
| 10985167 | Flexible merge scheme for source/drain epitaxy regions | Kai-Hsuan Lee, Chia-Ta Yu, Sheng-Chen Wang, Sai-Hooi Yeong, Feng-Cheng Yang +1 more | 2021-04-20 |