Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11176306 | Methods and systems to perform automated Integrated Fan-Out wafer level package routing | About Liao, Bing-Siang Chen, Happy Wang, Pagan Chou, Cheng-Chieh Chen +1 more | 2021-11-16 |
| 11100271 | Seamless transition between routing modes | Mysore Sriram, Praveeen Yadav | 2021-08-24 |
| 10909300 | Creating and reusing customizable structured interconnects | Hsiang-Wen Jimmy Lin, Friedrich Gunter Kurt Sendig, Mathieu Eric Drut | 2021-02-02 |