Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11176306 | Methods and systems to perform automated Integrated Fan-Out wafer level package routing | About Liao, Bing-Siang Chen, Pagan Chou, Cheng-Chieh Chen, Philippe Aubert McComber +1 more | 2021-11-16 |