Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205702 | Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit | Christophe Figuet, Bich-Yen Nguyen, Walter Schwarzenbach, Daniel Delprat, Ionut Radu | 2021-12-21 |
| 11127624 | Method of manufacturing a semiconductor on insulator type structure, notably for a front side type imager | Walter Schwarzenbach, Oleg Kononchuk | 2021-09-21 |
| 11127775 | Substrate for front side type imager and method of manufacturing such a substrate | Walter Schwarzenbach, Oleg Kononchuk, Christelle Michau | 2021-09-21 |
| 11114314 | Method for fabrication of a semiconductor structure including an interposer free from any through via | Bich-Yen Nguyen, Nadia Ben Mohamed, Christophe Malville | 2021-09-07 |