Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114314 | Method for fabrication of a semiconductor structure including an interposer free from any through via | Bich-Yen Nguyen, Ludovic Ecarnot, Nadia Ben Mohamed | 2021-09-07 |